Samsung, SK Hynix to Jointly Present at 'Hot Chips' for First Time in a Decade

Samsung Electronics and SK Hynix will share the stage at 'Hot Chips,' a high-performance semiconductor and computing architecture conference held in Silicon Valley, for the first time in 10 years since 2016. Both companies previously gave presentations on High Bandwidth Memory (HBM) back in 2016.

Launched in 1989, Hot Chips is a venue where major companies like Nvidia, AMD, and Intel unveil next-generation CPUs, GPUs, and packaging technologies. In recent years, the conference has reflected shifts in the semiconductor industry, such as the pivot from AI accelerators to AI data centers over the last three years.

This year's event includes memory technology in its program tutorials and features a newly established dedicated memory session. This is interpreted as a sign that memory is becoming a bottleneck in improving AI performance. According to the presentation schedule, Samsung PL Han Wook-woo will discuss 'Evolutionary Direction of HBM Base Die Using Logic Process,' while SK Hynix Americas Executive Vice President Lee Jae-sik will cover 'Advanced Packaging for HBM.'