HBM Height Standard Relaxation Discussed, Complicating Outlook for Equipment and Memory Firms

The International Semiconductor Standardization Organization (JEDEC) is reviewing a relaxation of the height standard for High Bandwidth Memory (HBM). This is expected to bring changes to the adoption timeline of next-generation equipment and the production strategies of memory manufacturers, with the industry closely watching the potential shift in HBM height standards.

JEDEC is reportedly considering easing the HBM product height to 900 micrometers (㎛), following the upward adjustment from 720㎛ (up to HBM3E) to 775㎛ (for HBM4).

A relaxation of the standard could delay the adoption of hybrid bonders needed for high-layer count HBM production. This could favor existing equipment suppliers such as Hanmi Semiconductor, the global leader in the HBM TC bonder market with a 71.2% share. On the other hand, companies like Hanwha Semitech, which have completed the development of their hybrid bonder and are preparing for customer testing in the first half of the year, may be affected by the delayed adoption timeline.

Memory manufacturers may welcome the standard relaxation as it could reduce the burden of investing in expensive equipment and allow them to utilize existing processes.

In the long term, as the development of high-layer count HBM, such as 16-stack and beyond, accelerates, the need for hybrid bonding technology is growing. SK Hynix has predicted that hybrid bonding will be essential for HBM with 20 or more stacks, and Samsung Electronics has also unveiled hybrid bonding technology supporting high-layer counts of 16 or more.

If the HBM height standard relaxation becomes a reality, it could lead to significant changes in equipment investment and memory production strategies. The final direction of the standard will likely be determined by a combination of customer demands, industry yield, and cost considerations.