Samsung Electronics to Upgrade Test Infrastructure with AMD EPYC Processors
Samsung Electronics will upgrade its semiconductor test infrastructure by combining AMD's next-generation processors with its own memory and storage products. The partnership is aimed at securing the computing power and data processing speeds required to verify the performance of high-performance memory and I/O devices.
According to industry sources on the 11th, AMD unveiled the 6th-generation 'EPYC Embedded 9006' series alongside reference configurations built with Samsung Electronics products. The featured products include DDR5 RDIMM and MRDIMM (high-bandwidth server memory), the 'PM1763' solid-state drive (SSD) based on PCIe Gen 6, the latest interface standard, and the 'CMM-D MD310' memory module based on CXL 3.2, which rapidly connects data and memory.
The new EPYC Embedded processors feature up to 256 cores and support PCIe Gen 6 and CXL 3.1 connectivity. According to AMD, throughput is up to 1.8 times higher compared to the 5th-generation EPYC 9005 series.
Applications span industrial systems such as semiconductor automated test equipment (ATE), enterprise storage, and network security appliances. The processors manage the inspection of memory and storage devices in semiconductor test equipment and run multiple tests simultaneously. In particular, they provide the computing and data processing capabilities needed to validate DDR5 RDIMM, next-generation MRDIMM, and PCIe Gen 6 and CXL-based devices.
Choi Jang-suk, Vice President of Samsung Electronics' Memory Product Planning Team, said through the AMD Newsroom: "The combination of Samsung Electronics' memory and storage products with AMD processors will significantly enhance the computing performance, memory bandwidth, and high-speed I/O capabilities required for manufacturing test infrastructure." Samsung Electronics expects that this combined configuration will substantially boost the performance and bandwidth of its manufacturing test environment in line with the pace of advances in memory and I/O technologies.
