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Samsung, SK Hynix Intensify Next-Gen HBM Tech Race
Samsung Electronics and SK Hynix have kicked off their next-generation High Bandwidth Memory (HBM) technology competition at Computex 2026 in Taiwan.
Samsung Electronics demonstrated its commitment to technological leadership by unveiling a physical mock-up of HBM5.
SK Hynix is moving to strengthen its market dominance by hinting at a strategy to expand wafer production. SK Hynix also met with NVIDIA CEO Jensen Huang, underscoring their cooperative relationship.
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