Samsung, SK Hynix Intensify Next-Gen HBM Tech Race

Samsung Electronics and SK Hynix have kicked off their next-generation High Bandwidth Memory (HBM) technology competition at Computex 2026 in Taiwan.

Samsung Electronics demonstrated its commitment to technological leadership by unveiling a physical mock-up of HBM5.

SK Hynix is moving to strengthen its market dominance by hinting at a strategy to expand wafer production. SK Hynix also met with NVIDIA CEO Jensen Huang, underscoring their cooperative relationship.