SK Chairman Chey Tae-won Meets TSMC Chairman to Bolster AI Semiconductor Cooperation

SK Group Chairman Chey Tae-won met with TSMC Chairman C.C. Wei in Taiwan on the 3rd (local time) to discuss cooperation in artificial intelligence (AI) semiconductors. During the meeting, the two leaders shared insights into next-generation AI technology trends and discussed strategies to lead the future AI ecosystem.

The two companies agreed to expand cooperation in the development of next-generation High Bandwidth Memory (HBM) and in the field of advanced packaging. With SK hynix leading the HBM market and TSMC possessing unique competitiveness in advanced process and packaging technologies, their collaboration is expected to alleviate bottlenecks in AI semiconductor production, specifically concerning packaging and memory supply, and to address the increasing demand for customized memory solutions from Big Tech companies.

This meeting highlights the intensifying competition to build an integrated ecosystem spanning design, foundry, memory, and packaging within the AI semiconductor value chain.