Samsung Electronics Renews Next-Gen AI Chip Foundry Collaboration with NVIDIA

Samsung Electronics is strengthening its technological competitiveness in the advanced foundry (semiconductor contract manufacturing) market by taking on the production of Groq's next-generation AI chip, the 'Groq 3 LPU'. This contract for the Groq 3 LPU chip places Samsung back in the spotlight to test its capabilities in the advanced AI semiconductor market.

The Groq 3 LPU chip, which Samsung will produce, is characterized by its ability to achieve data processing speeds several times faster than existing AI chips, even without High Bandwidth Memory (HBM). It features a design optimized for the inference process of large language models (LLMs) and for implementing 'agent AI' that can self-determine and act. The chip is expected to contain approximately 98 billion transistors and 500MB of high-speed static RAM (SRAM), and will be manufactured using Samsung's 4nm (SF4X) process. Product launch is anticipated for the third quarter of this year.

With this production contract, Samsung Foundry is expected to act as a variable that could alter the AI chip production structure, which has been largely dominated by Taiwan's TSMC.

This article was generated by AI and human-verified.