CoAsia SEMI Launches Mass Production of First Korean 3D IC Packaged SoC

CoAsia SEMI has commenced mass production of 3D IC packaged SoCs, a first for the Korean design services (DSP) industry. This achievement is significant as it demonstrates a domestic company's capability for actual mass production in the high-difficulty 3D packaging sector.

Following the start of its 3D IC package project in January, CoAsia SEMI has reaffirmed its leading position in this field through this mass production. 3D IC packaging presents extremely high manufacturing complexity, leading to many companies venturing into its development but few achieving successful mass production.

3D IC packaging stacks multiple chips, such as DRAM and logic SoCs, vertically using technologies like Through-Silicon Vias (TSV), which create micro-holes in chips for electrical connections. This method offers superior data transfer efficiency compared to traditional planar structures and is particularly advantageous for implementing Agentic AI, which is AI capable of independent judgment and action.